Epoxy/Silicon Potting Material Removal for Greater Recovery of Circuit Boards

Epoxy/Silicon Potting Material Removal for Greater Recovery of Circuit Boards

More cost-effective technologies are needed to remove coating or potting materials from circuit boards to enable repair and reuse. Two alternative technologies, laser ablation and micro-media blasting, will be tested and evaluated to quantify cost-effectiveness relative to industry specified cost targets.

Project Team:
Rochester Institute of Technology, Caterpillar Inc., CoreCentric Solutions

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18-01-RM-13

Condition Assessment of Used Electronics

Condition Assessment of Used Electronics

Detecting solder joint and interconnection failures on used electronics presents a serious cost challenge for remanufacturers because detection is currently completed manually. Several automated methods for detection of these failures will be examined to determine their feasibility for use in the remanufacturing industry.

Project Team:
Rochester Institute of Technology, Caterpillar Inc., CoreCentric Solutions

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18-01-RM-14