Epoxy/Silicon Potting Material Removal for Greater Recovery of Circuit Boards
More cost-effective technologies are needed to remove coating or potting materials from circuit boards to enable repair and reuse. Two alternative technologies, laser ablation and micro-media blasting, will be tested and evaluated to quantify cost-effectiveness relative to industry specified cost targets.
Project Team:
Rochester Institute of Technology, Caterpillar Inc., CoreCentric Solutions
18-01-RM-13